System and method for forming solder joints
AssigneeAgere Systems Inc.
InventorGeorge Kostiew
Life of this patent
Estimating the term…
Abstract
Disclosed herein are methods and devices for stimulating soldering of a substrate with a component during a reflow process. In an exemplified embodiment, the method involves placing a substrate/component combination into a reflow oven; directing the substrate/component combination to the heating zone of said reflow oven; and vibrating the substrate/component combination while said substrate/component combination is in said heating zone. The vibrating of the substrate/component combination occurs at a predetermined amplitude and frequency such that formation of a complete solder joint is stimulated without displacing said substrate and said component relative to each other.
Claims20
A method of forming a solder joint between a substrate and a component comprising solder disposed therebetween, said method comprising;
- placing a substrate/component combination into a reflow oven;
- directing said substrate/component combination to a heating zone of said reflow oven;
- and
- vibrating said substrate/component combination while said substrate/component combination is in said heating zone, wherein said vibrating occurs at a predetermined amplitude and frequency such that formation of a complete solder joint is encouraged without displacing said substrate and said component relative to each other.
A carrier designed for positioning onto a transfer conveyor of a reflow oven, said carrier comprising a vibrating device that vibrates at a predetermined time in a reflow process, or a predetermined temperature or predetermined position in the reflow oven.
A reflow oven for soldering electrical components to a substrate during a reflow process, said reflow oven comprising:
- a tunnel;
- a transfer conveyor for directing a substrate/component combination through said tunnel;
- a heating zone for generating soldering temperatures at a certain location in said tunnel;
- and
- a vibrating device interlinked to said transfer conveyor, wherein said vibrating device vibrates in said heating zone and vibrates at a predetermined amplitude and frequency such that formation of a complete solder joint is encouraged between said substrate and said component without displacing said substrate and said component relative to each other.
A carrier for holding a substrate/component combination during a reflow process, said carrier comprises a vibrating device engaged thereto that vibrates while said substrate/component combination is in said heating zone and vibrates at a predetermined amplitude and frequency such that formation of a complete solder joint is encouraged between said substrate and said component without displacing said substrate and said component relative to each other.
A reflow oven for soldering at least one component to a substrate during a reflow process, said reflow oven comprising:
- a tunnel;
- a transfer conveyor for directing a substrate/component combination through said tunnel;
- at least one heating zone for generating soldering temperatures at a certain location in said tunnel;
- and
- a platform designed for engaging said substrate/component combination during said reflow process, said platform comprising a vibrating device engaged thereto that vibrates while said substrate/component combination is in said heating zone and vibrates at a predetermined amplitude and frequency such that formation of a complete solder joint is stimulated between said substrate and said component without displacing said substrate and said component relative to each other.
In a reflow process for soldering together a substrate/component combination, the improvement comprising vibrating the substrate/component combination during the reflow process.
Dependencies are inferred from the claim text.