Method for cutting substrate using coolant
AssigneeSamsung Electronics Co., Ltd.
InventorsGi-Heon Kim, Dae-Ho Choo, Baek-Kyun Jeon, Hyung-Woo Nam
Life of this patent
Estimating the term…
Abstract
Disclosed is a method of cutting a liquid crystal display (LCD) unit cell from an LCD assembly panel. The method includes applying a coolant onto heated cutting path formed on the LCD assembly panel. A rapidly heated portion of the substrate is rapidly cooled using water having a high specific heat or a mixed coolant in which a material for improving characteristics of surface tension, viscosity and thermal conductivity is dissolved in water. Therefore, the cutting quality of the substrate is improved, and a cutting speed is also enhanced.
Claims13
A method of cutting a liquid crystal display (LCD) unit cell from an LCD assembly panel, comprising:
- heating a cutting path formed on the LCD assembly panel in which the LCD unit cell is surrounded by the cutting path;
- and
- applying a coolant onto the heated cutting path so that the LCD assembly panel is partially cut to a predetermined depth along the cutting path, the coolant having a specific heat equal to or higher than about 3.7 KJ/KgK.
A method of cutting a liquid crystal display (LCD) unit cell from an LCD assembly panel, comprising:
- heating a cutting path formed on the LCD assembly panel in which the LCD unit cell is surrounded by the cutting path;
- and
- applying a liquid coolant to the cutting path onto the heated cutting path so that the LCD assembly panel is partially cut to a predetermined depth along the cutting path.
Dependencies are inferred from the claim text.