Conductive ball bonding method and conductive ball bonding apparatus

A conductive ball bonding apparatus in which a conductive ball is conveyed to electrodes formed on objects to be bonded and said conveyed conductive ball is melted by irradiation of a laser beam to perform bonding between said electrodes, comprising:

• a pick-up nozzle having a pick-up opening for picking up said conductive ball, a substantially closed space communicated with said pick-up opening, and a transparent member disposed at a position opposed to said pick-up opening in said substantially closed space and defining said substantially closed space;
• and
• a laser radiating unit disposed at a position opposed to said pick-up opening with the interposition of said transparent member;
• and wherein
• said laser radiating unit and said pick-up nozzle can be shifted relative to each other.

A pick-up nozzle which is used when predetermined processing is performed by conveying an object to be held to a predetermined position while absorbing and holding said object and by irradiating a laser beam onto said object to be held in a condition that said object to be held is substantially held at said predetermined position, said pick-up nozzle comprising:

• a pick-up opening for picking up said object to be held;
• a substantially closed space communicated with said pick-up opening and capable of being evacuated and vacuum-ruptured;
• and
• a transparent member disposed at a position opposed to said pick-up opening and forming a part of a wall defining said substantially closed space and capable of permeating the laser beam.