Semiconductor substrate polishing methods and equipment

A method comprising:

• placing a semiconductor substrate in an electrolytic solution, the semiconductor substrate having a surface, at least a portion of the surface being metal;
• contacting the surface of the semiconductor substrate with at least one conductive member;
• applying a voltage across electrolytic solution and the at least one conductive member;
• and
• moving the at least one conductive member across the surface of the semiconductor substrate, the electrolytic solution removing metal ions from the metal when the at least one conductive member contacts the metal portion of the surface of the semiconductor wafer.

A method comprising:

• contacting a polish head with a surface of semiconductor substrate, the semiconductor substrate having a surface, at least a portion of the surface being metal;
• moving the polish head relative to the surface of the semiconductor substrate to cause the polish head to polish the surface of the semiconductor substrate;
• placing the semiconductor substrate in an electrolytic solution;
• contacting the surface of the semiconductor substrate with at least one conductive member;
• applying a voltage across electrolytic solution and the at least one conductive member;
• and
• moving the at least one conductive member across the surface of the semiconductor substrate, the electrolytic solution removing metal ions from the metal when the at least one conductive member contacts the metal portion of the surface of the semiconductor wafer.

A semiconductor substrate processing apparatus comprising:

• a frame;
• a liquid container connected to the frame to hold an electrolytic solution;
• a semiconductor substrate support to support a semiconductor substrate while the semiconductor substrate is immersed in the electrolytic solution;
• at least one conductive member moveably connected to the frame to contact and move across a surface of the semiconductor substrate while the semiconductor substrate is immersed in the electrolytic solution;
• and
• a voltage supply, having a first electrode electrically connected to the at least one conductive member and a second electrode electrically connected to the electrolytic solution, to supply a voltage across the at least one conductive member and the electrolytic solution.