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US 2006/0065534 A1Published application
Plating apparatus, plating method and multilayer printed circuit board
AssigneeIbiden Co., Ltd.
InventorsToru Nakai, Satoru Kawai, Hiroshi Niwa, Yoshiyuki Iwata
Life of this patent
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Abstract
A plating apparatus includes a plating bath, a member provided in the plating bath and a moving device. The member is configured to cover a surface to be plated. A moving device is configured to relatively move the member or the surface to change an area of the surface covered by the member.
Claims21
A plating apparatus comprising:
- a plating bath;
- a member provided in the plating bath and configured to cover a surface to be plated;
- and
- a moving device configured to relatively move the member or the surface to change an area of the surface covered by the member.
1 more element
A plating apparatus comprising:
- a plating bath;
- covering means for covering a surface to be plated;
- and
- moving means for relatively moving the covering means or the surface to change an area of the surface covered by the covering means.
1 more element
A plating method comprising:
- providing an article in a plating bath;
- providing a member in the plating bath to cover a surface of the article to be plated;
- electrolytically plating the surface of the article;
- and
- relatively moving the member or the article to change an area of the surface covered by the member while the surface of the article is electrolytically plated.
2 more elements
A multilayer printed circuit board comprising:
- an insulation layer;
- a first conductor layer provided on a first side of the insulation layer;
- a second conductor layer provided on a second side of the insulation layer opposite to the first side;
- and
- plural filled vias electrically connecting the first conductor layer and the second conductor layer, all of the plural filled vias having upper surfaces such that a difference between a lowest surface and a highest surface of each of the upper surfaces is less than or equal to about 7 μm.
2 more elements
Dependencies are inferred from the claim text.