Circuitized substrate with improved impedance contol circuitry, method of making same, electrical assembly and information handling system utilizing same

A method of making a circuitized substrate, said method comprising:

• providing a first conductive layer having a first plurality of conductive pads oriented in a pattern and adapted for being electrically coupled to a first electrical component;
• providing a second conductive layer including a plurality of signal lines;
• electrically coupling selected ones of said signal lines to respective ones of said conductive pads of said first plurality of conductive pads;
• providing a first dielectric layer positioned substantially between said first and second conductive layers,
• providing a third conductive layer including a first voltage plane and a second plurality of conductive pads also oriented in a pattern;
• electrically coupling selected ones of said second plurality of conductive pads to respective ones of said signal lines of said second conductive layer;
• and
• providing a second dielectric layer substantially between said second and third conductive layers such that said plurality of signal lines are positioned substantially between said first conductive layer and said first voltage plane of said third conductive layer so as to substantially prevent impedance disruption during the transmission of signals through said signal lines.

An information handling system comprising:

• a housing;
• a circuitized substrate positioned substantially within said housing and including a first conductive layer having a first plurality of conductive pads oriented in a pattern, a second conductive layer including a plurality of signal lines, selected ones of said signal lines being electrically coupled to respective ones of said conductive pads of said first plurality of conductive pads, a first dielectric layer positioned substantially between said first and second conductive layers, a third conductive layer including a first voltage plane and a second plurality of conductive pads also oriented in a pattern, selected ones of said second plurality of conductive pads being electrically coupled to respective ones of said signal lines of said second conductive layer, and a second dielectric layer positioned substantially between said second and third conductive layers, said plurality of signal lines being positioned substantially between said first conductive layer and said first voltage plane of said third conductive layer so as to substantially prevent impedance disruption during the transmission of signals through said signal lines;
• and
• at least one electrical component positioned substantially on said circuitized substrate and electrically coupled to said first plurality of conductive pads.