Electronic assemblies and methods of making the same
AssigneeGeneral Electric Company
InventorsSandeep Tonapi, Arun Gowda, Kevin Durocher, David Esler, Hong Zhong, Ananth Prabhakumar
Life of this patent
Estimating the term…
Abstract
An electronic assembly having at least a heat dissipating unit and a heat generating unit is provided. At least one of the heat dissipating unit and the heat generating unit has at least one deliberately modified surface.
Claims29
A thermal resistance network comprising a heat dissipating unit, a die, and at least one thermal interface material located between the heat dissipating unit and the die, wherein at least one of said heat dissipating unit and said die has a deliberately modified surface.
A thermal resistance network comprising a heat dissipating unit, having at least one deliberatly modified surface, a heat generating unit having at least one deliberatly modified surface and a thermal interface material deposited between said heat dissipating unit and said heat generating unit.
A thermal resistance network comprising a heat sink, a heat spreader having a first side and a second side, a die having a first side and a second side, a first thermal interface material located adjacent said second side of said heat spreader and said first side of said die, and a second thermal interface material located adjacent said first side of said heat spreader and said heat sink, wherein at least one of said first side of heat spreader, said second side of said heat spreader, and said first side of said die has a deliberately modified surface.
A method of forming a thermal resistance network comprising the steps of:
- providing a heat sink;
- providing a heat spreader;
- providing a die;
- modifying at least one surface of at least one of said heat spreader and said die;
- and
- providing at least one thermal interface material between said heat spreader and said die.
A semiconductor device comprising at least one heat dissipating unit, a die, at least one thermal interface material, and a circuit, wherein at least one of the heat spreader and the die has a deliberately modified surface.
Dependencies are inferred from the claim text.