Capacitance type physical quantity sensor having sensor chip and circuit chip
AssigneeDenso Corporation
InventorKeisuke Goto
Life of this patent
Estimating the term…
Abstract
A capacitance type physical quantity sensor includes a sensor chip and a circuit chip. The sensor chip includes: a support substrate; a semiconductor layer; a movable electrode; and a fixed electrode. The sensor chip is stacked on the circuit chip such that the movable electrode and the fixed electrode face the circuit chip. The movable electrode has a thickness in a stacking direction. The sensor chip has a first distance between the movable electrode and the circuit chip and a second distance between the movable electrode and the support substrate. The thickness of the movable electrode is larger than the first distance and the second distance.
Claims8
A capacitance type physical quantity sensor comprising:
- a sensor chip for detecting a physical quantity;
- and
- a circuit chip for processing a signal outputted from the sensor chip, wherein
- the sensor chip includes:
- a support substrate;
- a semiconductor layer disposed on one side of the substrate;
- a movable electrode disposed in the semiconductor layer and displaceable in a direction parallel to the substrate in accordance with the physical quantity;
- and
- a fixed electrode disposed in the semiconductor layer and facing the movable electrode,
- the sensor chip is capable of detecting the physical quantity on the basis of a capacitance change of a capacitor provided between the movable electrode and the fixed electrode,
- the capacitance change is provided by a displacement of the movable electrode in accordance with the physical quantity,
- the sensor chip is stacked on the circuit chip in such a manner that the movable electrode and the fixed electrode face the circuit chip,
- the sensor chip is electrically connected to the circuit chip,
- the movable electrode has a thickness in a stacking direction of the sensor chip,
- the sensor chip has a first distance between the movable electrode and the circuit chip and a second distance between the movable electrode and the support substrate, and
- the thickness of the movable electrode is larger than the first distance and the second distance.
Dependencies are inferred from the claim text.