In-die hydropiercing device for piercing holes in hydroformed parts

An in-die hydropiercing device comprising a die button adapted to be mounted in one of two hydroforming dies that form a die cavity for the hydroforming of a part, a punch received in the die button having an annular blade with a shearing edge, a center support member received in the punch blade adapted to be fixed to the one die and to support the part within the center of the blade during the hydroforming of the part, a hydraulic cylinder adapted to operate the punch so as to hold the blade in a non-piercing position within the die button during the hydroforming of the part and to extend the blade past the die button and the center support member to pierce a hole in the hydroformed part with the shearing edge and with the support of hydroforming fluid under pressure in the hydroformed part and whereby a slug is pierced from the hydroformed part and pressed against the center support member by the hydroforming pressure, a slug retainer mounted on the center support member adapted to retain the slug against the center support member when the hydroforming pressure is exhausted and then release the slug upon opening of the dies, the punch blade also being adapted to effect sealing between the punch blade and both the hydroformed part and the slug during the formation of the hole to prevent leakage of the hydroforming fluid past the punch blade following the initial piercing of the hydroformed part, and a slug collector adapted to be inserted between the dies on opening of the dies and collect the slug from the center support member on release by the slug retainer device and then retract with the collected slug for slug disposal.