Method of manufactruing circuit board
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsYoshihiro Kawakita, Toshiaki Takenaka, Tadashi Tojyo
Life of this patent
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Abstract
A pre-preg sheet including a substrate and a resin impregnated in the substrate is provided. A first metal foil is placed on the pre-preg sheet to provide a laminated body. The laminated body is put in a heating device having a temperature maintained at a temperature close to a softening temperature of the resin. The laminated body is compressed at the temperature at a predetermined pressure. The first metal foil is bonded to the pre-preg sheet of the laminated body and hardening the resin, thus providing a circuit board. This method provides a stable resistance of a conductive paste filling a through-hole in the pre-preg sheet to be compressed at a small rate.
Claims31
A method of manufacturing a circuit board, comprising:
- providing a pre-preg sheet including a substrate and a resin impregnated in the substrate, the pre-preg sheet having a first surface and a second surface opposite to the first surface;
- placing a first metal foil on the first surface of the pre-preg sheet to provide a laminated body;
- putting the laminated body in a heating device having a temperature maintained at a temperature close to a softening temperature of the resin;
- compressing the laminated body at the temperature at a predetermined pressure;
- and
- bonding the first metal foil to the pre-preg sheet of the laminated body and hardening the resin.
A method of manufacturing a circuit board, comprising:
- preparing a pre-preg sheet including a substrate and a resin impregnated in the substrate, the pre-preg sheet having a first surface and a second surface opposite to the first surface;
- placing a first metal foil on the first surface of the pre-preg sheet at a temperature close to a softening temperature of the resin to provide a laminated body;
- compressing the laminated body;
- and
- bonding the first metal foil to the pre-preg sheet of the laminated body and hardening the resin.
A method of manufacturing a circuit board, comprising:
- preparing a pre-preg sheet including a substrate and a resin impregnated in the substrate, the pre-preg sheet having a first surface and a second surface opposite to the first surface;
- placing a first metal foil on the first surface of the pre-preg sheet to provide a laminated body;
- compressing the laminated body at a temperature close to a softening temperature of the resin at a predetermined pressure;
- cooling the laminated body to have a temperature not higher than the softening temperature of the resin after said compressing the laminated body at the predetermined pressure;
- and
- bonding the first metal foil to the pre-preg sheet of the laminated body and hardening the resin.
Dependencies are inferred from the claim text.