Pattern data correcting method, photo mask manufacturing method, semiconductor device manufacturing method, program and semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorSuigen Kyoh
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AssigneeKabushiki Kaisha Toshiba
InventorSuigen Kyoh
Estimating the term…
There is provided a method of correcting pattern data for a semiconductor device, including acquiring pattern data for a lower layer, pattern data for an upper layer, and pattern data for a connecting layer containing connecting patterns to connect patterns contained in the lower layer and patterns contained in the upper layer, grouping patterns contained in the lower layer, the upper layer, and the connecting layer into a plurality of groups in which patterns in the same group are to be set at the same electric potential, acquiring a first distance between one edge of one connecting pattern contained in one group and an edge of a pattern contained in another group, and moving the one edge in a direction in which a size of the one connecting pattern increases, based on the first distance.
A method of correcting pattern data for a semiconductor device, comprising:
A computer program product configured to store program instructions for execution on a computer and used for correcting pattern data for a semiconductor device, the program instructions causing the computer to perform:
A semiconductor device having a plurality of groups in which patterns in the same group are to be set at the same electric potential, each of the groups comprising:
Dependencies are inferred from the claim text.