Thin module system and method

A circuit module comprising:

• a flex circuit having a first major side populated with a plurality of CSPs and a second major side populated with a plurality of CSPs, the first major side having first and second sets of plural insertion contacts;
• a substrate having first and second lateral sides and an edge about which is disposed a part of the flex circuit to place the first set of plural insertion contacts along the second lateral side of the metallic material substrate and the second set of plural insertion contacts along the first lateral side of the metallic material substrate and the plurality of CSPs that populate the second major side of the flex circuit being disposed between the metallic material substrate and the flex circuit.

A circuit module to encourage the extraction of thermal energy from a CSP that operates in conjunction with at least one other CSP in the circuit module, the circuit module comprising:

• a flex circuit having a set of insertion contacts and a first side populated with a plurality of CSPs and a second side populated with a plurality of CSPs, each of the CSPs having an upper surface;
• a metallic material substrate having first and second lateral sides and an extension and an edge about which the flex circuit is disposed, the CSPs that populate the second side of the flex circuit being disposed between the first lateral side of the metallic material substrate and the flex circuit with at least some of the upper surfaces of said CSPs being thermally connected to the first lateral side of the metallic material substrate while the insertion contacts are disposed proximal to the edge of the metallic material substrate to allow insertion of the circuit module into an edge connector.