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AssigneeCabot Microelectronics Corporation
InventorAbaneshwar Prasad
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A method of manufacturing a chemical-mechanical polishing (CMP) pad comprises the steps of (a) forming a layer of a polymer resin liquid solution (i.e., a polymer resin dissolved in a solvent); (b) inducing a phase separation in the layer of polymer solution to produce an interpenetrating polymeric network comprising a continuous polymer-rich phase interspersed with a continuous polymer-depleted phase in which the polymer-depleted phase constitutes about 20 to about 90 percent of the combined volume of the phases; (c) solidifying the continuous polymer-rich phase to form a porous polymer sheet; (d) removing at least a portion of the polymer-depleted phase from the porous polymer sheet; and (e) forming a CMP pad therefrom. The method provides for microporous CMP pads having a porosity and pore size that can be readily controlled by selecting the concentration polymer resin in the polymer solution, selecting the solvent based on the solubility parameters of the polymer in the solvent polarity of solvent, selecting the conditions for phase separation, and the like.
A method of manufacturing a chemical-mechanical polishing (CMP) pad comprising the steps of:
A chemical mechanical polishing (CMP) pad comprising a porous polymeric sheet and defining a network of substantially interconnected pores having a porosity in the range of about 20 to about 90 percent, the network of pores comprising pores having diameters in the range of about 0.01 to about 10 microns and having a pore size distribution in which at least about 75% of the pores have a pore size within 5 microns of the average pore size.
Dependencies are inferred from the claim text.