A holding apparatus which has a holding member having an attachment surface for a polishing body, a vacuum source, and a vacuum duct which is disposed inside the holding member, with one end of this vacuum duct being opened in the attachment surface and the other end thereof being connected to the vacuum source, and which causes the polishing body to be held by suction on the attachment surface by sucking air through the vacuum duct, the holding apparatus comprising:
- an orifice which is disposed in the vacuum duct;
- two pressure detection means which detect a pressure inside the vacuum duct at positions before and after the orifice;
- and
- judgment means which judges whether or not the polishing body is held by suction on the holding member on the basis of the pressure difference before and after the orifice detected by the two pressure detection means.