Methods of forming a plurality of capacitors

A method of forming a plurality of capacitors, comprising:

• forming a plurality of capacitor electrode openings within a capacitor electrode-forming material received over a substrate, the capacitor electrode-forming material comprising silicon dioxide;
• forming conductive first capacitor electrode material within the plurality of capacitor electrode openings;
• after forming the first capacitor electrode material, forming a sacrificial retaining structure elevationally over both the first capacitor electrode material and the capacitor electrode-forming material, the sacrificial retaining structure having a substantially planar base received on both silicon dioxide of the capacitor electrode-forming material and on the first capacitor electrode material, the retaining structure leaving some of the capacitor electrode-forming material exposed;
• with the sacrificial retaining structure received elevationally over the first capacitor electrode material and elevationally over the capacitor electrode-forming material, etching at least some of the capacitor electrode-forming material from the substrate effective to expose outer sidewall surfaces of the first capacitor electrode material;
• and
• after the etching, removing the sacrificial retaining structure from the substrate and then forming capacitor dielectric material and conductive second capacitor electrode material over the outer sidewall surfaces of the first capacitor electrode material.

A method of forming a plurality of capacitors, comprising:

• forming a plurality of capacitor electrode openings within homogeneous capacitor electrode-forming material received over a substrate;
• forming conductive first capacitor electrode material within the plurality of capacitor electrode openings;
• after forming the first capacitor electrode material, forming a sacrificial retaining structure elevationally over both the first capacitor electrode material and the homogeneous capacitor electrode-forming material, the sacrificial retaining structure being received on the homogeneous capacitor electrode-forming material, the retaining structure leaving some of the homogeneous capacitor electrode-forming material exposed;
• with the sacrificial retaining structure received elevationally over the first capacitor electrode material and elevationally over the capacitor electrode-forming material, etching at least some of the homogeneous capacitor electrode-forming material from the substrate effective to expose outer sidewall surfaces of the first capacitor electrode material;
• and
• after the etching, removing the sacrificial retaining structure from the substrate and then forming capacitor dielectric material and conductive second capacitor electrode material over the outer sidewall surfaces of the first capacitor electrode material.

A method of forming a plurality of capacitors, comprising:

• forming a plurality of capacitor electrode openings within capacitor electrode-forming material received over a substrate;
• forming conductive first capacitor electrode material within the plurality of capacitor electrode openings;
• after forming the first capacitor electrode material, forming a sacrificial retaining structure, the sacrificial retaining structure comprising at least one of polysilicon, amorphous carbon and silicon nitride, and having a substantially planar base received elevationally over the first capacitor electrode material and elevationally over the capacitor electrode-forming material, the retaining structure leaving some of the capacitor electrode-forming material exposed;
• with the sacrificial retaining structure received elevationally over the first capacitor electrode material and elevationally over the capacitor electrode-forming material, etching at least some of the capacitor electrode-forming material from the substrate effective to expose outer sidewall surfaces of the first capacitor electrode material;
• and
• after the etching, removing the sacrificial retaining structure from the substrate and then forming capacitor dielectric material and conductive second capacitor electrode material over the outer sidewall surfaces of the first capacitor electrode material.