Conductive lithographic polymer and method of making devices using same
AssigneeIntel Corporation
InventorsRebecca Shia, Jack Chen
Life of this patent
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Abstract
A conductive photolithographic film and method of forming a device using the conductive photolithographic film. The method includes depositing a conductive photolithographic film on a top surface of a substrate; and patterning the conductive photolithographic film to create a desired circuit pattern using a lithographic process. The conductive photolithographic film comprising about 50% to about 60% of a mixture of epoxy acrylate, a thermal curing agent, and a conductive polymer; about 20% to about 30% of a lithographic reactive component; about 10% to about 15% of a photo-active material; and about 3% to about 5% of additives that enhance conductivity of the conductive photolithographic polymer.
Claims34
A conductive photolithographic polymer comprising:
- about 50% to about 60% of a mixture of epoxy acrylate, a thermal curing agent, and a conductive polymer;
- about 20% to about 30% of a lithographic reactive component;
- about 10% to about 15% of a photo-active material;
- and
- about 3% to about 5% of additives that enhance conductivity of the conductive photolithographic polymer.
A method of fabricating a device comprising:
- depositing a conductive photolithographic film on a top surface of a substrate;
- and
- patterning the conductive photolithographic film to create a desired circuit pattern using a lithographic process.
An electronic device comprising:
- a substrate;
- a dielectric layer formed on the substrate;
- a conductive photolithographic film formed on top of the dielectric layer, wherein the conductive photolithographic film is patterned according to a desired circuit pattern using a lithographic process.
A method of fabricating a device comprising:
- depositing a conductive photolithographic film on a top surface of an insulation layer, the insulation layer formed on a substrate;
- masking, the conductive photolithographic film according to a desired circuit pattern;
- exposing the conductive photolithographic film to light;
- and
- developing the conductive photolithographic film and removing unmasked portions of the conductive photolithographic film.
The method of claim 32 further comprising:
- forming a second insulation layer on the substrate and over the conductive photolithographic film after the masking, exposing, and developing;
- depositing a second conductive photolithographic film on a top surface of the second insulation layer;
- masking, the second conductive photolithographic film according to a desired circuit pattern;
- exposing the second conductive photolithographic film to light;
- and
- developing the second conductive photolithographic film and removing unmasked portions of the second conductive photolithographic film.
Dependencies are inferred from the claim text.