Lithographic method for wiring a side surface of a substrate

A lithographic method of providing at least one side surface of a substrate with electrical wiring comprising at least one electrically conducting strip, which method comprises the steps of:

• providing a substrate comprising at least one side surface;
• coating the at least one side surface with a resist layer;
• providing a mask comprising a mask pattern having a number of exposure radiation passing areas corresponding to the number of side surfaces to be wired;
• providing a proximity printing apparatus comprising a source of exposure radiation, a mask holder and a substrate holder;
• arranging the substrate in the substrate holder and the mask in the mask holder, such that the radiation passing areas of the mask pattern face the substrate side surfaces to be wired;
• exposing the said surfaces via the radiation passing area;
• selectively removing resist material from the resist layer thereby forming a resist pattern, and
• using the resist pattern as a mask for configuring conductive material to obtain the required wiring, characterized in that use is made of an exposure beam, which is substantially perpendicular to the mask pattern and of a mask pattern wherein each exposure radiation passing area comprise a diffraction structure to diffract exposure radiation to the relevant substrate surface.