Tin plating
AssigneeShipley Company, L.L.C.
InventorJeffrey Crosby
Life of this patent
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Abstract
Electrolyte compositions for the deposition of tin and tin-alloys on a substrate are disclosed, along with methods of electroplating tin and tin-alloys using such compositions. These electrolyte compositions are useful for high speed tin plating.
Claims7
1-17. (canceled)
A bright tin or bright lead-free tin-alloy deposited on a substrate from an electrolyte comprising one or more tin compounds, one or more acidic electrolytes, and one or more carboxylated polyalkyleneimine compounds, the bright tin or bright lead-free tin-alloy has no whiskers after 4 months storage at 52° C. and 98% relative humidity.
A bright tin or bright lead-free tin-alloy deposited on a substrate from an electrolyte comprising one or more tin compounds, one or more acidic electrolytes, and one or more carboxylated polyalkyleneimine compounds, the bright tin or bright lead-free tin-alloy does not have whiskers after 5 months of storage at 52° C. and 98% relative humidity.
A bright tin or bright lead-free tin alloy deposited on a substrate from an electrolyte comprising one or more tin compounds, one or more acidic electrolytes, and one or more carboxylxated polyalkyleneimine compounds, the bright tin or bright lead-free tin-alloy does not have whiskers after 6 months of storage at 52° C. and 98% relative humidity.
Dependencies are inferred from the claim text.