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AssigneeNippon Sheet Glass Co., Ltd.
InventorsToshiaki Anzaki, Daisuke Inaoka, Yoshifumi Kijima
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The present invention provides a method for forming a titanium compound film on a substrate by a sputtering process by use of, in place of a conventional metallic titanium target, a titanium target containing a metal (such as tin or zinc) having two or more times higher sputtering yield in an argon atmosphere than titanium; an article coated with a titanium compound film; and a sputtering target for use in the film coating. The content of tin or zinc in the titanium target containing tin or zinc is preferably in the range of 1 to 45 at %, and further a third metal may be added. These can remove drawbacks in that the film has a low film formation rate and a high output power cannot be applied due to the occurrence of arcing in forming a titanium compound film on the surface of a substrate, such as plate-shaped glass, by a reactive sputtering process.
A method for producing an article coated with a titanium compound film characterized in that a titanium target containing 1 to less than or equal to 45 at % of a metal with two or more times higher sputtering yield than that of titanium in an argon atmosphere is used in forming the titanium compound film on a substrate by a reactive sputtering process.
An article coated with a titanium compound film containing a metal, wherein the metal has two or more times higher sputtering yield in an argon atmosphere than that of titanium and the metal content ratio of the metal to titanium is 1 to less than or equal to 45 at %.
A titanium target containing a metal, which is used for forming a titanium compound film on a substrate by a reactive sputtering process, characterized in that the metal has two or more times higher sputtering yield in an argon atmosphere than titanium and the metal content ratio of the metal to titanium is 1 to less than or equal to 45 at %.
Dependencies are inferred from the claim text.