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US 2006/0050489 A1Published application
Optimized mounting area circuit module system and method
AssigneeStaktek Group L.P.
InventorsJames Wehrly, Mark Wolfe, Paul Goodwin
Life of this patent
Estimating the term…
Abstract
A flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of its major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. A rigid substrate is configured to provide space on one side where the populated flex is disposed while in some embodiments, heat management or cooling structures are arranged on one side of the module to mitigate thermal accumulation in the module.
Claims37
A circuit module comprising:
- (a) a rigid substrate having first and second opposing lateral sides, a body section having a body section axis and an end section having an end section axis and the rigid substrate having a deformation area between the body section and the end section to offset from each other the body section and end section axes to create a substrate space disposed on a selected one of first and second sides of the circuit module;
- and
- (b) a flex circuit having first and second sides, the first side of the flex circuit having plural contacts supported by the rigid substrate and adapted for connection to an operating environment and at least one of the first and second sides of the flex circuit being populated with plural ICs of a first type.
A circuit module comprising:
- a rigid substrate having an end portion with an end axis and a body portion having a body axis, the body axis being offset from the end axis through a deformation area of the rigid substrate to form a substrate space;
- a flex circuit having a first and a second side, the flex circuit being populated with at least memory ICs on at least one of its first and second sides and being disposed in part about an edge of the rigid substrate to place the memory ICs closer to a first of first and second sides of the module than to the second of the first and second sides of the module.
A circuit module comprising:
- a thermally conductive rigid substrate having an extension and a first side and a second side and an end portion with an end axis and a body portion having a body axis, the body axis being offset from the end axis through a deformation area of the rigid substrate to form a substrate space;
- a flex circuit having a first side and a second side, the flex circuit being populated with memory ICs on its first and second sides and at least one IC of second type on its second side and the flex circuit being disposed in part about an edge of the rigid substrate to place the said ICs closer to a first of first and second sides of the module than to the second of the first and second sides of the module.
Dependencies are inferred from the claim text.