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US 2006/0050432 A1Published application
Head design with overlapping coil for narrow pitch tape head
AssigneeHitachi Global Storage Technologies Netherlands B. V.
InventorsEdward Lee, David Seagle
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Abstract
The structure for a closely spaced, coplanar tape head array is disclosed. Narrow pitch is obtained by utilizing an overlapping coil structure, wherein write coils of adjacent heads overlap. The overlap is made possible by placing coils of adjacent heads at different levels within the thin film structure, separated by dielectric insulating layers.
Claims27
A thin film head array comprising:
- a first head further comprising
- a first upper pole,
- a first lower pole containing a first lower pole tip magnetically coupled to a lower pole layer, and
- a first write coil disposed between said first upper pole and said first lower pole;
- a second head further comprising
- a second upper pole,
- a second lower pole containing a second lower pole tip magnetically coupled to said lower pole layer, and
- a second write coil disposed between said second upper pole and said second lower pole;
- wherein said first head is adjacent to said second head, and a portion of said first write coil overlaps at least a portion of said second write coil.
6 more elements
A thin film head array comprising:
- a first head further comprising
- a first upper pole containing a first upper pole tip magnetically coupled to a first yoke,
- a first lower pole containing a first lower pole tip magnetically coupled to a first lower pole layer,
- a first write coil disposed between said first upper pole and said first lower pole, and
- a first write gap disposed between said first upper pole tip and said first lower pole tip;
- a second head further comprising
- a second upper pole containing a second upper pole tip magnetically coupled to a second yoke,
- a second lower pole containing a second lower pole tip magnetically coupled to a second lower pole layer,
- a second write coil disposed between said second upper pole and said second lower pole, and
- a second write gap disposed between said second upper pole tip and said second lower pole tip;
- wherein
- said first head is adjacent to said second head,
- a portion of said first write coil overlaps at least a portion of said second write coil, and
- said first write gap and said second write gap lie approximately in a plane perpendicular to an air bearing surface.
11 more elements
A method for making a thin film head array comprising:
- providing a substrate having a top surface;
- depositing a lower pole layer on said top surface of said substrate;
- depositing a first dielectric layer on a top surface of said lower pole layer;
- forming a first coil structure of a first write head on a top surface of said first dielectric layer;
- depositing a plurality of second dielectric layers, said plurality of second dielectric layers enclosing a top surface of said first coil structure;
- forming a second coil structure of a second write head on a top surface of said plurality of second dielectric layers;
- wherein said first write head is adjacent to said second write head, and a portion of said second coil structure overlaps at least a portion of said first coil structure.
4 more elements
Dependencies are inferred from the claim text.