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US 2006/0049564 A1Published application
Semiconductor element holding apparatus and semiconductor device manufactured using the same
AssigneeOki Electric Industry Co., Ltd.
InventorHiroyuki Tokudome
Life of this patent
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Abstract
A semiconductor element holding apparatus includes a collet for suctioning a semiconductor element by negative pressure to hold the semiconductor element. The collet has a protrusion formed at the semiconductor element-holding surface thereof, and the protrusion is provided with a plurality of suction holes. The suction holes are opened to the semiconductor element-holding surface. The surface of the semiconductor element is held by the semiconductor element-holding surface of the protrusion of the collet.
Claims15
A semiconductor element holding apparatus comprising:
- a collet for suctioning a semiconductor element by negative pressure to hold the semiconductor element;
- a protrusion extending from the collect such that the protrusion defines a semiconductor element-holding surface of the collet;
- and
- a plurality of suction holes formed in the protrusion such that the plurality of suction holes are opened in the semiconductor element-holding surface.
1 more element
A semiconductor element holding apparatus comprising:
- first means for suctioning a semiconductor element by negative pressure to hold the semiconductor element;
- second means protruding from the first means such that the second means defines a semiconductor element-holding surface of the first means;
- and
- third means formed in the second means such that the third means open in the semiconductor element-holding surface of the first means for applying a suction force to the semiconductor element.
1 more element
Dependencies are inferred from the claim text.