Chip module
AssigneesInfineon Technologies AG, DELO Industrie Klebstoffe GmbH & Co. KG
InventorsFrank Puschner, Dietmar Dengler, Wolfgang Schindler, Thomas Spottl
Life of this patent
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Abstract
A chip module having a chip which is mounted by means of chip adhesive on a mount and is electrically connected via bonding wires to contact pads, and an encapsulation compound which surrounds the chip and the bonding wires and is bounded by a subarea of the mount. The encapsulation compound is radiation-hardened and heat-hardened in a combined form and has radiation-impermeable pigments.
Claims32
A chip module, comprising:
- a chip which is mounted by means of chip adhesive on a mount and is electrically connected via bonding wires to contact pads;
- and
- an encapsulation compound which surrounds the chip and the bonding wires and is bounded by a subarea of the mount,
- wherein the encapsulation compound is radiation-hardened and heat-hardened in a combined form and has radiation-impermeable pigments.
A method for producing a chip module, comprising the steps of:
- mounting a chip on a mount by means of a flexible, cationically polymerizing epoxy chip adhesive;
- connecting the chip to contact pads by means of bonding wires;
- producing a dam from a flexible, cationically polymerizing encapsulation compound around the chip and the bonding wires;
- and
- filling the dam with a flexible, cationically polymerizing encapsulation compound,
- wherein the encapsulation compound and the dam are impermeable for radiation in the wavelength range from 200 nm to 2500 nm by coloring with pigments in the cured state, and are cured by a combination of irradiation with electromagnetic radiation and application of heat.
An encapsulation compound, which is made impermeable to radiation in the wavelength range from 200 nm to 2500 nm by coloring with pigments in the cured state, and is cured by a combination of irradiation with electromagnetic radiation and application of heat.
Dependencies are inferred from the claim text.