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US 2006/0049531 A1Published application
Semiconductor package having a partial slot cover for encapsulation process
OwnerBrad Rumseyinventor
Life of this patent
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Abstract
A system and method for encapsulating an integrated circuit package is provided. More specifically, a system and method for encapsulating a board-on-chip package is described. A strip of material is disposed on one end of the slot in the substrate to control the flow of the molding compound during the encapsulation process.
Claims20
A semiconductor package comprising:
- a semiconductor device having a first surface and a second surface;
- a substrate having a first surface and a second surface and having a slot disposed through the substrate, the first surface of the substrate being coupled to the second surface of the semiconductor device such that the slot is partially covered by the semiconductor device, and wherein the ends of the slot are left open by the semiconductor device;
- a molding compound disposed about at least a portion of the semiconductor device;
- and
- a material covering one end of the slot, wherein the material comprises a barrier having molding compound on opposing sides thereof.
2 more elements
A semiconductor package comprising:
- a semiconductor device having a first surface and a second surface;
- a substrate having a first surface and a second surface and having a slot disposed through the substrate, the first surface of the substrate being coupled to the second surface of the semiconductor device such that the slot is partially covered by the semiconductor device, and wherein the ends of the slot are left open by the semiconductor device;
- a barrier layer covering one end of the slot;
- and
- a molding compound disposed about at least one side of the barrier layer.
2 more elements
A semiconductor package comprising:
- a semiconductor device having a first surface and a second surface;
- a substrate having a first surface and a second surface and having a slot disposed through the substrate, the first surface of the substrate being coupled to the second surface of the semiconductor device such that the slot is partially covered by the semiconductor device, wherein a first end of the slot is covered by a first end of the semiconductor device and a second end of the slot is left open by a second end of the semiconductor device;
- and
- a molding compound disposed about at least a portion of the semiconductor device, wherein the molding compound is disposed about opposite sides of the first end of the semiconductor device.
1 more element
Dependencies are inferred from the claim text.