Method of embedding semiconductor chip in support plate and embedded structure thereof

A method of embedding a semiconductor chip in a support plate, comprising the steps of:

• providing a dielectric layer having a reinforced filling material, and mounting at least one semiconductor chip on the dielectric layer;
• providing a support plate having at least one predetermined opening and a carrier plate having an adhesive layer on a surface thereof;
• and
• pressing the dielectric layer mounted with the semiconductor chip, the support plate, and the carrier plate together, with the support plate being disposed between the dielectric layer and the carrier plate, such that the semiconductor chip is received in the opening of the support plate, and the dielectric layer fills a gap between the semiconductor chip and the opening of the support plate.

An embedded structure having a semiconductor chip embedded in a support plate, comprising:

• a support plate having at least one opening and formed on a dielectric layer having a reinforced filling material;
• at least one semiconductor chip received in the opening of the support plate;
• and
• another dielectric layer having a reinforced filling material, which is formed on the support plate and fills a gap between the semiconductor chip and the opening of the support plate.