Back to results
US 2006/0049523 A1Published application
Wire-bonding method for connecting wire-bond pads and chip and the structure formed thereby
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorYi Lin
Life of this patent
Estimating the term…
Abstract
A wire-bonding method for connecting a wire-bond pad and a chip is characterized in that a metal ball is disposed on the wire-bond pad such that a bonding wire can be electrically connected to the wire-bond pad and raised to a certain height by the metal ball. In this arrangement, the short circuit problem caused by two adjacent wire-bond pads and impact problem on a solder mask caused by a bond head of a wire bonder during a wire bonding process can be avoided. The present invention also provides a package having a structure formed by the above-mentioned wire-bonding method.
Claims7
A semiconductor package, comprising:
- a substrate having a chip area defined on its upper surface and a plurality of conductive traces disposed around the chip area, wherein each of the conductive traces has a wire-bond pad;
- a solder mask covering the conductive traces with the wire-bond pads exposed therefrom and having at least one opening formed therein, wherein the wire-bond pads of the conductive traces are exposed at the opening;
- a semiconductor chip being disposed on the chip area and having a plurality of pads;
- a metal ball disposed on one of the wire-bond pads of the conductive traces;
- and
- a plurality of bonding wires each electrically connecting each wire-bond pad of the conductive traces and each pad of the semiconductor chip;
- wherein the metal ball is electrically connected between the one of the wire-bond pads and one of the bonding wires;
- and
- wherein the height of the metal ball with respect to the upper surface of the substrate is greater than the thickness of the solder mask.
6 more elements
Dependencies are inferred from the claim text.