Semiconductor device and method for manufacturing the same
AssigneeSeiko Epson Corporation
InventorYasunori Kurosawa
Life of this patent
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Abstract
A semiconductor device, comprising: a semiconductor substrate in which an integrated circuit is formed, the semiconductor substrate having an electrode electrically connected to the integrated circuit; a resin layer formed on a face in which the electrode of the semiconductor substrate is formed, as to avoid the electrode; a wiring formed as to have a protruding portion projecting upwards on the resin layer, the wiring being electrically connected to the electrode; and a solder formed on the protruding portion of the wiring, wherein the upper face portion of the protruding portion is melt-eroded by the solder and the material of the protruding portion.
Claims4
A semiconductor device, comprising:
- a semiconductor substrate in which an integrated circuit is formed, the semiconductor substrate having an electrode electrically connected to the integrated circuit;
- a resin layer formed on a face in which the electrode of the semiconductor substrate is formed, as to avoid at least a part of the electrode;
- a wiring formed as to have a protruding portion projecting upwards on the resin layer, the wiring being electrically connected to the electrode;
- and
- a solder formed on the protruding portion of the wiring,
- wherein the upper face portion of the protruding portion is melt-eroded by the solder and the material of the protruding portion.
A method for manufacturing semiconductor devices, comprising the steps of:
- forming a resin layer on a face in which an electrode is formed, the electrode being electrically connected to an integrated circuit of a semiconductor substrate having the integrated circuit, as to avoid at least a part of the electrode;
- forming a wiring having a protruding portion projecting upwards on the resin layer, the wiring being electrically connected to the electrode;
- forming a solder-resist layer as to cover at least a part of the wiring and as not to be put on the edge of the protruding portion;
- and
- thereafter forming a solder on the protruding portion as to be supported by the resin layer.
Dependencies are inferred from the claim text.