Semiconductor device, lead frame, and methods for manufacturing the same

Abstract

In a semiconductor device in which a semiconductor chip is mounted on a die pad, an electrode on the surface of the chip and a lead arranged around the die pad are connected with a wire, and the semiconductor chip, the wire and a wire connecting portion of the lead are collectively resin molded with a sealing resin, a step part is formed at a tip end portion of at least one lead so that the tip end becomes lower than the rest of the step part, and a plurality of wires connected to a same or different electrodes on the semiconductor chip are connected to each step of the step part. As a plurality of wires bonded to a same lead can be separated vertically, a stable connection becomes possible and each lead can be set to have a minimum width necessary for bonding one wire, allowing the lead to be arranged closer to the semiconductor chip correspondingly.

Dependencies are inferred from the claim text.