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US 2006/0049500 A1Published application
Thin module system and method
AssigneeStaktek Group L.P.
InventorPaul Goodwin
Life of this patent
Estimating the term…
Abstract
Modules with larger areas for device mounting but minimized profiles are provided. In preferred embodiments, modules that employ one or more flex circuits have sculpted supportive substrates to selectively accommodate larger or taller profile devices. In several preferred embodiments, higher profile circuits such as AMBs, for example, are disposed in what are, in a preferred embodiment, windows, pockets, or cutaway areas in the substrate. In other preferred embodiments, both the substrate and the flexible circuitry have openings into which a device of greater profile such as, for example, an AMB or a logic device with or without a resident heat sink are provided with a volume to occupy without adding the full profile of the taller device to the profile of the module itself.
Claims45
A circuit module comprising:
- a flex circuit having a first side, a second side, and an IC opening passing through the flex circuit and plural contacts along the first side adapted for connection to a circuit board socket;
- at least one CSP of a first type mounted on the second side of the flex circuit;
- and
- a rigid substrate having first and second opposing lateral sides and a window passing through the rigid substrate, the flex circuit being disposed about the rigid substrate to dispose the at least one CSP of a first type into the window passing through the rigid substrate.
1 more element
A circuit module comprising:
- a flex circuit having a first side, a second side, an IC opening that passes through the flex circuit, and a set of contacts for insertion in a circuit board socket, the first side being populated with plural CSPs of a first type, the second side being populated with a CSP of a second type;
- and
- a rigid substrate having first and second lateral sides, an edge, and a window that passes through the rigid substrate, the flex circuit being wrapped about the edge of the rigid substrate to dispose the plural CSPs of the first type on the outside of the module and the CSP of the second type into the window of the rigid substrate.
A circuit module comprising:
- a flex circuit having a first side, a second side, an IC opening and a set of contacts for connecting the module to a circuit board connector, the flex circuit being populated on its first side with memory CSPs and on its second side with at least one IC of a selected type;
- a supporting substrate having a first side, a second side, a window passing through the supporting substrate and an edge, about which the flex circuit is wrapped to dispose the first side of the flex circuit further from the supporting substrate than is the second side of the flex circuit and dispose the at least one IC of the selected type into the window of the supporting substrate.
A circuit module comprising:
- a flex circuit having a first side and a second side and first and second openings through the flex circuit and there being along the first side, a plurality of expansion board contacts;
- memory CSPs disposed on the second side of the flex circuit;
- first and second AMBs disposed on the second side of the flex circuit;
- and
- a substrate having first and second windows and an edge about which edge the flex circuit is disposed to dispose the first AMB into the first window of the substrate and dispose the second AMB into the second window of the substrate.
2 more elements
A circuit module comprising:
- a flexible circuit having a plurality of connector contacts, a first major side, a second major side, and first and second IC openings, the flex circuit having two or more rows of surface mount arrays on the second major side, the flexible circuit having an arcuate bend between a selected two of the two or more rows of surface mount arrays on the second major side, the second major side facing inward to the arcuate bend;
- a plurality of CSP memory devices populated along the two or more rows of surface mount arrays of the second major side, each of the CSP memory devices having a top major surface;
- first and second AMBs populated along the first major side of flexible circuit.
- a support substrate partially within the arcuate bend, the support substrate having a first side, a second side, and first and second AMB windows and an edge, the top major surface of one of the plurality of CSP memory devices populated along the two or more rows of surface mount arrays of the second major side being attached to the top major surface of one of the plurality of CSP memory devices populated along another one of the two or more rows of surface mount arrays of the second major side and the first and second AMBs being disposed in the first and second AMB windows and emergent from the first and second IC openings of the flex circuit, respectively.
1 more element
A circuit module comprising:
- a flex circuit having a first side, a second side, a perimeter edge and a set of circuit board connector contacts, the flex circuit being populated on its first side with plural CSPs of a first type and populated on its second side with at least one IC of a second type;
- a substrate having first and second sides and an edge and a window through which the at least one IC of the second type is inserted to dispose the plural CSPs of the first type on the first side of the substrate and cause the at least one IC of the second type to emerge from the second side of the substrate through the window of the substrate.
Dependencies are inferred from the claim text.