Surface acoustic wave device and manufacturing method of the same
AssigneeFujitsu Media Devices Limited
InventorsNaoyuki Mishima, Takumi Kooriike
Life of this patent
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Abstract
A surface acoustic wave device has a SAW device element 10 and a package 20 housing the SAW device element. The package includes a resin substrate 20 having metal patterns 21 and 22 formed on both surfaces thereof, and a resin cap 32. The SAW device element is mounted on one of the metal patterns of the resin substrate. The resin cap is adhered to the resin substrate to cover the SAW device element. The surfaces of the resin substrate are flush with corresponding end surfaces of the resin cap.
Claims12
A surface acoustic wave device comprising:
- a surface acoustic wave (SAW) device element;
- and
- a package housing the SAW device element,
- wherein:
- the package includes a resin substrate having metal patterns formed on both surfaces thereof, and a resin cap;
- the SAW device element is mounted on one of the metal patterns of the resin substrate;
- the resin cap is adhered to the resin substrate to cover the SAW device element;
- and
- end surfaces of the resin substrate are flush with corresponding end surfaces of the resin cap.
The surface acoustic wave device as claimed 1, wherein:
- the metal patterns on the opposing surfaces of the resin substrate are connected to each other through one or more contact through holes formed on at least one end surface of the resin substrate;
- and
- the one or more contact through holes include a metallized inner surface of the through hole.
The surface acoustic wave device as claimed 2, further comprising a lid of resin film provided at an end of the one or more contact through holes located on a side of the resin substrate on which side the SAW device element is provided.
The surface acoustic wave device as claimed 2, wherein:
- the contact through hole is filled with a resin;
- and
- the resin has a cut surface flush with an end surface of the resin substrate.
The surface acoustic wave device as claimed 4, wherein metal plating lids are formed on both surfaces of the resin.
The surface acoustic wave device as claimed 1, wherein:
- the metal patterns on the opposing surfaces of the resin substrate are connected to each other through one or more contact through holes;
- and
- the one or more contact through holes passing through the resin substrate are formed on an area except a portion where the resin cap is connected to the resin substrate.
The surface acoustic wave device as claimed 6, wherein the one or more contact through holes are provided under the SAW device element.
The surface acoustic wave device as claimed 1, wherein the resin cap is adhered to a portion of the resin substrate except a portion where the metal patterns are formed.
The surface acoustic wave device as claimed 1, further comprising a metal wire connecting the SAW device element to one of the metal patterns of the resin substrate,
- wherein a cross-sectional shape of a ceiling in the resin cap is a divot shape avoiding a looping shape of the metal wire.
The surface acoustic wave device as claimed 1, further comprising a metal wire connecting the SAW device element to one of the metal patterns of the resin substrate,
- wherein a portion of the resin cap covering the surface acoustic wave device element is formed of metal.
A method of manufacturing a surface acoustic wave device comprising the steps of:
- adhering a first resin substrate having metal patterns on both surfaces thereof and having surface acoustic wave (SAW) device elements mounted on one of the metal patterns in an array of rows and columns at intervals, and a second resin substrate having hollows formed in an array of rows and columns at the same intervals as those of the first substrate so as to cover the SAW device element face to face each other by an adhesive so that the SAW device element is covered with the second resin substrate;
- and
- cutting the first resin substrate and the second resin substrate simultaneously into devices, each of which has one SAW device element.
A method of manufacturing a surface acoustic wave device comprising the steps of:
- adhering a resin substrate having metal patterns on both surfaces thereof, having surface acoustic wave (SAW) device elements mounted on one of the metal patterns in an array of rows and columns at intervals and having a resin frame surrounding the SAW device element individually, and a resin lid covering the SAW device element and the resin lid, through the resin frame;
- and
- cutting the resin substrate and the resin lid simultaneously into devices, each of which has one SAW device element.
Dependencies are inferred from the claim text.