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US 2006/0049487 A1Published application
Semiconductor device and method of manufacturing the same
AssigneeCanon Kabushiki Kaisha
InventorsNobuhiko Sato, Shigeru Kido, Kazutaka Momoi
Life of this patent
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Abstract
A semiconductor device manufacturing method is disclosed. A semiconductor substrate having a separation region and a semiconductor region which covers the separation region entirely is prepared. One or a plurality of circuit elements are formed in the semiconductor region. The semiconductor substrate is split at the separation region.
Claims15
A semiconductor device manufacturing method, comprising:
- a step of preparing a semiconductor substrate having a separation region and a semiconductor region which covers the separation region entirely;
- a step of forming one or a plurality of circuit elements in the semiconductor region;
- and
- a step of splitting the semiconductor substrate at the separation region.
1 more element
A semiconductor device manufacturing method, comprising:
- a step of preparing a semiconductor substrate having a semiconductor region;
- a step of forming one or a plurality of circuit elements in the semiconductor region;
- a step of forming a separation region, which is entirely covered with the semiconductor region, in the semiconductor substrate;
- and
- a step of splitting the semiconductor substrate at the separation region.
2 more elements
A semiconductor device comprising:
- a separation region;
- a semiconductor region which covers said separation region entirely;
- and
- one or a plurality of circuit elements formed in said semiconductor region,
- wherein said separation region is formed under a region where at least said one or plurality of circuit elements are to be formed.
2 more elements
Dependencies are inferred from the claim text.