Solid state device and light-emitting element
AssigneeToyoda Gosei Co., Ltd.
InventorsYoshinobu Suehiro, Masayoshi Ichikawa, Satoshi Wada, Koji Tasumi
Life of this patent
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Abstract
A solid-state device having: a flip-chip mounted solid-state element; a power receiving/feeding portion having a mounting substrate to allow that a mounting surface of the solid-state element forms substantially the same plane as a surface of the mounting substrate; and an inorganic sealing portion made of an inorganic sealing material having a thermal expansion coefficient equal to that of the power receiving/feeding portion for sealing the solid-state element.
Claims33
A solid-state device, comprising:
- a flip-chip mounted solid-state element;
- a power receiving/feeding portion comprising a mounting substrate to allow that a mounting surface of the solid-state element forms substantially the same plane as a surface of the mounting substrate;
- and
- an inorganic sealing portion made of an inorganic sealing material having a thermal expansion coefficient equal to that of the power receiving/feeding portion for sealing the solid-state element.
A light-emitting element, comprising:
- p and n contact electrodes formed on a flip-chip mounting surface of the light-emitting element corresponding to one light-emitting layer of the light-emitting element;
- and
- a fusion-bonding portion formed on the p and n contact electrodes corresponding to the p and n contact electrodes, for being fusion-bonded to an external mounting pattern.
A light-emitting device, comprising:
- a light-emitting element comprising on a flip-chip mounting surface a contact electrode which serves as a reflection mirror, and a fusion-bonding portion formed on the contact electrode;
- a mounting substrate comprising an external mounting pattern fusion-bonded to the fusion-bonding portion;
- and
- a light-transmitting sealing portion for sealing the light-emitting element fusion-bonded to the mounting substrate.
A light-emitting device, comprising:
- a light-emitting element comprising on a flip-chip mounting surface a contact electrode which serves as a reflection mirror;
- a mounting substrate comprising a fusion-bonding portion fusion-bonded to the contact electrode;
- and
- a light-transmitting sealing portion for sealing the light-emitting element fusion-bonded to the mounting substrate.
Dependencies are inferred from the claim text.