Dynamic profile anode
AssigneeSurfect Technologies, Inc.
InventorsThomas Griego, Fernando Sanchez
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Abstract
A dynamic profile anode whose shape can be varied to optimize the current distribution to a substrate during highly controlled electrodeposition. Enhanced control of the process provides for a more uniform deposit thickness over the entire substrate, and permits reliable plating of submicron features. The anode is particularly useful for electroplating submicron structures. The anode is advantageously able to use metallic ion sources and may be placed close to the cathode thus minimizing contamination of the substrate. The anode profile may be varied during the deposition process. The anode may consist of multiple concentric regions, each of which may be operated at independent voltages and currents.
Claims20
An anode for use in an electrochemical process, the anode comprising:
- a plurality of parallel electrically conducting elements arranged in a plurality of zones;
- and
- one or more separators for separating said zones.
A method of electrolytically depositing a material on a substrate, the method comprising the steps of:
- providing an electrolytic cell;
- providing an anode comprising a plurality of parallel electrically conducting elements arranged in a plurality of separated zones;
- and
- independently setting a value of an electrical characteristic for each of the zones.
Dependencies are inferred from the claim text.