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US 2006/0048969 A1Published application
Bus structure
AssigneePrimax Electronics Ltd.
InventorsKuo-Ching Huang, Yu-Cheng Chang
Life of this patent
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Abstract
A bus structure includes multiple soft buses and a soft separation layer. These multiple soft buses are stacked side by side each other. The soft separation layer is sandwitched between two adjacent soft buses.
Claims6
A bus structure comprising:
- a plurality of soft buses which are disposed side by side;
- and
- a soft separation layer sandwitched between two adjacent soft buses.
Dependencies are inferred from the claim text.