Apparatus and method for fabricating bonded substrate
AssigneeFujitsu Limited
InventorsTakanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
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Abstract
A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
Claims5
An apparatus for fabricating a bonded substrate by bonding two substrates, the apparatus comprising:
- a process chamber;
- first and second holding plates, arranged in the process chamber to face each other, to hold the two substrates and bond the two substrates to each other, wherein at least one of the first or second holding plates is configured to vacuum hold at least one of the two substrates f the interior of the process chamber is at an atmospheric pressure and is configured to electrostatically hold the associated substrate if the interior of the process chamber is depressurized, and wherein a back pressure of said at least one of the substrates is approximately equalized to a pressure in the process chamber when said at least one of the first or second holding plates electrostatically holds the associated substrate.
A method of bonding two substrates held by first and second holding plates arranged to face each other in a process chamber, at least one of the first and second holding plates having a vacuum holding mode and an electrostatic holding mode, the method comprising:
- vacuum holding said at least one of the two substrates by said at least one of the first or second holding plates;
- approximately equalizing a back pressure of said at least one of the substrates to a pressure in the process chamber;
- and
- switching the holding mode of said at least one of the first or second holding plates from the vacuum holding mode to the electrostatic holding mode.
Dependencies are inferred from the claim text.