Method for connecting a chip and a substrate
AssigneeFraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
InventorsMichael Feil, Martin Koenig
Life of this patent
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Abstract
In a method of connecting a chip and a substrate, an adhesive having conductive particles is initially provided. The chip and the substrate each include at least one pad on one appropriate side. The adhesive is applied onto one side of the substrate or onto one side of the chip, and the chip and the substrate are connected, the pads being aligned one below the other. Subsequently, this arrangement is pressurized such that in the region between the pads of the chip and the substrate, local compaction of the adhesive results, and the conductive particles adhere to the pads. Finally, the adhesive is hardened.
Claims8
1-7. (canceled)
A method of connecting a chip having pads on one side and a substrate having pads on one side by means of a
- conductive adhesive including conductive particles, independently of the pad geometry, the pads of the chip and/or of the substrate projecting with regard to a surface, the method comprising:
- (a) applying the conductive adhesive to that side of the substrate on which the pads are located,
- and/or to that side of the chip on which the pads are located, the conductive adhesive comprising a multiplicity of conductive particles which are substantially evenly spread in a resin matrix;
- (b) joining the chip and the substrate, the pads of the chip and the substrate being aligned one below the other;
- (c) applying, to the joined arrangement, a pressure selected such that in the region between the pads of the chip and of the substrate, local compaction of the adhesive results, and the conductive particles adhere to the pads;
- and
- (d) hardening the conductive adhesive without pressurization.
Dependencies are inferred from the claim text.