US 2006/0048383 A1 · Reference position determining method and apparatus for electronic component mounting

Abstract

In a printing apparatus, individual positional data for positions of four object marks provided on a plurality of FPCs held on a conveyance tray are acquired by a mark position acquisition section based on an image acquired by an image acquisition unit. In a displaced mark specifying section, relative positional relations of four object marks are determined, and compared with a reference positional relation, by which a displaced object mark is specified. Then, in a reference position determining section, a reference position for a plurality of FPCs on a conveyance tray is determined based on a plurality of object marks resulting from excluding the displaced object mark out of the four object marks. Thus, a reference position in execution of printing in a printing unit can be determined with high precision.

Claims12

Dependent claims

A reference position determining method for electronic component mounting, to determine a reference position for a circuit board in execution of a process related to mounting of electronic components onto the circuit board, the method comprising:

acquiring respective positional data for positions of three or more reference-position-determining marks which are provided on one or more circuit boards to be integrally treated in the process;
specifying a displaced mark out of the three or more marks, by determining relative positional relations of the individual positions with respect to the three or more marks and then comparing the determined positional relations with a predetermined reference positional relation;
and
determining the reference position for the one or more circuit boards by using the individual positional data of two or more marks resulting from excluding the displaced mark specified out of the three or more marks.

1 more element

A reference position determining device for electronic component mounting, to determine a reference position for a circuit board in execution of a process related to mounting of electronic components onto the circuit board, the device comprising:

an image pickup device for picking up an image of the one or more circuit boards to be integrally treated in the process in a state the circuit boards are held;
a mark position acquisition section for acquiring positional data for respective positions of three or more reference-position-determining marks provided on the one or more circuit boards from the image picked up by the image pickup device;
a displaced mark specifying section for determining relative positional relations of the individual positions with respect to the three or more marks, and comparing the determined positional relations with a predetermined reference positional relation, thereby specifying a displaced mark out of the three or more marks;
and
a reference position determining section for determining the reference position for the one or more circuit boards by using the individual positional data of two or more marks resulting from excluding the displaced mark specified out of the three or more marks.

2 more elements

Dependencies are inferred from the claim text.

Reference position determining method and apparatus for electronic component mounting

Life of this patent

Reference position determining method and apparatus for electronic component mounting

Life of this patent

Abstract

Claims12