Multiprocessor chip having bidirectional ring interconnect
OwnerGeorge Chrysos, Matthew Mattina +1inventors
InventorsGeorge Chrysos, Matthew Mattina, Stephen Felix
Life of this patent
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OwnerGeorge Chrysos, Matthew Mattina +1inventors
InventorsGeorge Chrysos, Matthew Mattina, Stephen Felix
Estimating the term…
Embodiments of the present invention are related in general to on-chip integration of multiple components on a single die and in particular to on-chip integration of multiple processors via a bidirectional ring interconnect. An embodiment of a semiconductor chip includes a plurality of processors, an address space shared between the processors, and a bidirectional ring interconnect to couple the processors and the address space. An embodiment of a method includes calculating distances between a packet source and destination on multiple ring interconnects, determining on which interconnect to transport the packet, and then transporting the packet on the determined interconnect. Embodiments provide improved latency and bandwidth in a multiprocessor chip. Exemplary applications include chip multiprocessing.
An apparatus comprising at least one bidirectional ring structure on a semiconductor chip.
A semiconductor chip comprising:
A system comprising:
A method comprising:
A machine readable medium having stored thereon a plurality of executable instructions to perform a method comprising:
Dependencies are inferred from the claim text.