Compressible films surrounding solder connectors
AssigneeInternational Business Machines Corporation
InventorsWilliam Bernier, Tien-Jen Cheng, Marie Cole, David Eichstadt, Mukta Farooq, John Fitzsimmons, Lewis Goldmann, John Knickerbocker, Tasha Lopez, David Welsh
Life of this patent
Estimating the term…
Abstract
Disclosed is a method of forming an integrated circuit structure that forms lead-free connectors on a device, surrounds the lead-free connectors with a compressible film, connects the device to a carrier (the lead-free connectors electrically connect the device to the carrier), and fills the gaps between the carrier and the device with an insulating underfill.
Claims22
An integrated circuit s e comprising:
- a carrier;
- a device connected to said carrier;
- solder connectors electrically connecting said device to said carrier;
- a compressible film surrounding sides of said solder connectors, wherein said compressible film has sufficient compressibility to accommodate expansion of said solder connections when said solder connections are melted without damaging said insulating material;
- and
- an insulating material filling gaps between said carrier and said device.
(canceled)
An integrated circuit structure comprising:
- a carrier;
- a device connected to said carrier;
- lead-free connectors electrically connecting said device to said carrier;
- a compressible film surrounding sides of said lead-free connectors, wherein said compressible film has sufficient compressibility to accommodate expansion of said lead-free connections when said lead-free connections are melted without damaging said underfill;
- and
- an insulating underfill filling gaps between said carrier and said device.
(canceled)
15-28. (canceled)
An integrated circuit structure comprising:
- a carrier;
- a device connected to said carrier;
- solder connectors electrically connecting said device to said carrier;
- a compressible film comprising one of a rubber and a foam surrounding sides of said solder connectors;
- and
- an insulating material filling gaps between said carrier and said device.
Dependencies are inferred from the claim text.