IC socket with improved housing
AssigneeHon Hai Precision Ind. Co., Ltd.
InventorsFang-Jwu Liao, Hao-Yun Ma
Life of this patent
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Abstract
An IC socket (1) includes an insulative housing (2) and large numbers of contacts (9) received therein. The housing defines arrayed contact receiving cavities (22) for accommodating the contacts. The cavities are arranged in array by first partition walls (24) and second partition walls (25), which are perpendicular to each other. The first partition wall is higher than the second partition wall. Each first partition wall is provided with protruding portions (240) and sunken portions (241), which are alternatively arranged.
Claims12
An Integrated Circuit (IC) socket to be mounted on a circuit board, comprising:
- an insulative housing, which has a plurality of cavities arranged in a matrix at an IC package receiving recess surrounded by peripheral walls;
- a plurality of electrical contacts, which are provided in the plurality of cavities;
- and a fixing mechanism for fixing an IC package in the IC package receiving recess;
- wherein
- the insulative housing comprises first partition walls, which are provided between rows of cavities, and second partition walls, which are provided between rows of cavities and are perpendicular to the first partition walls, the first partition walls having protruding portions and sunken portions alternatively formed along a longitudinal direction thereof.
An Integrated Circuit (IC) socket for carrying an IC package thereon, comprising:
- an insulative housing, which has a plurality of cavities arranged in a matrix at an IC package receiving recess surrounded by peripheral walls;
- a plurality of electrical contacts secured in the plurality of cavities, the contacts being formed from a material strip and defines a spring arm extending out of the housing;
- and
- a fixing mechanism for fixing an IC package in the IC package receiving recess formed by peripheral walls;
- wherein
- the insulative housing defines a plurality of partition walls partitioning the cavities into a plurality of rows, and the partition walls are provided with protruding portions and sunken portions, which are arranged alternatively, the protruding portions defines a seating plane for supporting the IC package.
An IC socket assembly comprising:
- an insulative housing, which has a plurality of passageways arranged in matrix at an IC package receiving cavity surrounded by peripheral walls;
- a plurality of electrical contacts respectively secured in the plurality of passageways, the contacts being formed from a material strip and defines a spring arm upwardly extending into the receiving cavity;
- and
- a moveable fixing mechanism for holding an IC package in the IC package receiving cavity;
- the insulative housing defines a plurality of first partition walls partitioning the passageways into a plurality of rows along a lengthwise direction of the housing, and a plurality of second partition walls partitioning the passageways into a plurality of columns along a transverse direction perpendicular to said lengthwise direction;
- and
- an electronic package downwardly loaded to the receiving cavity to be seated to press downwardly the spring arms;
- wherein
- the second partition wall is recessed below the first partition wall for allowing downward movement of the spring arm of the corresponding contact which extends across the second partition and depressed downwardly by the electronic package.
Dependencies are inferred from the claim text.