Method for making a microelectronic interposer
AssigneeTessera, Inc.
InventorsThomas Distefano, Joseph Fjelstad
Life of this patent
Estimating the term…
Abstract
A microelectronic interposer is made by providing a sacrificial layer over the surface of a planar body. Apertures are formed passing through the body and the sacrificial layer. A layer of an electrically conductive structural material is deposited in each of the apertures and over the sacrificial layer, proximate to each aperture to thereby form contacts. The sacrificial layer is removed leaving the contacts with outwardly flaring peripheral portions spaced vertically above the surface of the planar body.
Claims12
A method of making a microelectronic interposer comprising the steps of:
- (a) providing a body defining a first surface;
- (b) providing a first compliant layer over said first surface of said body;
- (c) forming apertures passing through said body and said first and second compliant layers;
- (d) depositing a first layer of an electrically conductive structural material in each said aperture and over said first compliant layer proximate said aperture to thereby form first contacts with outwardly flaring peripheral portions on said first compliant layer.
A method of making a microelectronic interposer comprising the steps of:
- (a) providing a body having first and second opposing spaced apart surfaces;
- (b) providing a first compliant layer over said first surface of said body;
- (c) providing a second compliant layer over said second surface of said body;
- (d) forming apertures passing through said body and said first and second compliant layers;
- (e) depositing a first layer of an electrically conductive structural material in each said aperture and over said first compliant layer proximate said aperture to thereby form first contacts with outwardly flaring peripheral portions on said first compliant layer;
- (f) depositing a second layer of an electrically conductive structural material in each said aperture and over said second compliant layer proximate said aperture to thereby form second contacts with outwardly flaring peripheral portions on said second compliant layer;
- (g) partially etching said first compliant layer whereby said first compliant layer has a thickness under said first contacts greater than a thickness of said first compliant layer between said first contacts;
- and
- (h) partially etching said second compliant layer whereby said second compliant layer has a thickness under said second contacts greater than a thickness of said second compliant layer between said second contacts.
A method of making a microelectronic interposer comprising the steps of:
- (a) providing a compliant layer having first and second surfaces;
- (b) forming apertures passing through said compliant layer;
- (c) depositing a first layer of an electrically conductive structural material in each said aperture and over said first surface proximate said aperture to thereby form first contacts with outwardly flaring peripheral portions on said first surface;
- (d) depositing a second layer of an electrically conductive structural material in each said aperture and over said second surface proximate said aperture to thereby form second contacts with outwardly flaring peripheral portions on said second surface;
- and
- (e) partially etching at least one of said first and second surfaces whereby said compliant layer has a thickness under said contacts greater than a thickness of said compliant layer between said contacts.
Dependencies are inferred from the claim text.