Photoresist trimming process
AssigneeInternational Business Machines Corporation
InventorsShaun Crawford, Cuc Huynh, A. Reid, Adam Smith, Thomas Wagner
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Abstract
A photoresist trimming gas compound is provided which will selectively remove a resist foot or scum from the lower portions of sidewalls of a photoresist. Additionally, the trimmer compound hardens or toughens an upper surface of the photoresist thereby strengthening the photoresist. The trimmer compound includes O2 and at least one other gaseous oxide and is typically utilized in a dry etching process after a trench has been formed in a photoresist The other oxide gases, in addition to the O2 may include CO2, SO2 and NO2.
Claims20
A method of photoresist trimming, comprising the steps of:
- forming a resist foot in a trench;
- and
- removing the resist foot found in the trench during a trimming process.
A method of forming an imaging mask, comprising the steps of:
- arranging an opaque layer on a transparent substrate;
- arranging a mask material on the opaque layer;
- imaging the mask with a prescribed pattern;
- and
- trimming an etched mask with a trimming gas comprising O2 and at least one other oxide gas.
A trim gas for etching a mask foot formed at a base of a sidewall pattern, comprising O2 and at least one other oxide gas comprising at least any one of CO2, SO2, and NO
Dependencies are inferred from the claim text.