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US 2006/0040472 A1Published application
Method for separating semiconductor substrate
AssigneeDenso Corporation
InventorsMuneo Tamura, Yasuo Souki
Life of this patent
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AssigneeDenso Corporation
InventorsMuneo Tamura, Yasuo Souki
Estimating the term…
A method of separating a semiconductor substrate having an implementation member attached thereon includes a dividing process for at least the implementation member on the semiconductor substrate along a separation line, a placing process for film member on a same side as the implementation member, a forming process area by irradiating a laser beam from at least one of a first side of the semiconductor substrate having the implementation member and a second side that is an opposite side of the first side of the semiconductor substrate along the separation line with a focusing point of the laser beam aligned with a substance in the semiconductor substrate and severing/removing at least one semiconductor chip at the separation line from the semiconductor substrate.
A method for separating a semiconductor substrate having an implementation member attached thereon comprising the steps of:
A method for separating a semiconductor substrate comprising the steps of:
A method for separating a semiconductor substrate comprising the steps of:
Dependencies are inferred from the claim text.