Process and apparatus for thinning a semiconductor workpiece
AssigneeSemitool, Inc.
InventorsKert Dolechek, Raymon Thompson
Life of this patent
Estimating the term…
Abstract
The present invention provides system and apparatus for use in processing wafers. The new system and apparatus allows for the production of thinner wafers that at same time remain strong. As a result, the wafers produced by the present process are less susceptible to breaking. The unique system also offers an improved structure for handling thinned wafers and reduces the number of processing steps. This results in improved yields and improved process efficiency.
Claims82
A chuck for receiving and supporting a workpiece having a device side and a back side, the device side having a rim disposed on a peripheral portion thereof, the chuck comprising:
- a body for supporting the workpiece having a groove formed in a surface of the body for receiving the rim of the workpiece;
- and
- a compressible member disposed in the groove forming a seal between the rim and the body.
A chuck for receiving and supporting a workpiece having a device side and a back side, the device side having a rim disposed on a peripheral portion thereof, the chuck comprising:
- a body for supporting the workpiece and adapted to sealably engage the workpiece, the body having a groove formed in a surface for receiving the rim of the workpiece;
- and
- a member disposed in the groove, the member forming a seal between the rim and the body when the rim of the workpiece is received in the groove.
A chuck for receiving and supporting a workpiece having a device side and a back side, the device side having a rim extending outwardly from a peripheral portion thereof, the chuck comprising:
- a body for supporting the workpiece, the body having a groove formed therein;
- a retainer removeably attached to the body and adapted to engage the rim and the body thereby securing the workpiece to the body;
- and
- a compressible member disposed in the groove in the body and forming a seal between the body and the rim.
A semiconductor workpiece comprising:
- a main body having a thickness less than approximately 300 microns;
- and
- a rim connected to a peripheral portion of the workpiece and having a thickness in a range of approximately 0.030 to 0.190 inch.
A semiconductor workpiece having a device side and a back side comprising:
- a main body having a thickness less than approximately 150 microns;
- and
- a rim disposed on a peripheral portion of the device side.
A semiconductor workpiece having a device side and back side, the device side having a surface area, DSSA, the semiconductor workpiece comprising:
- a polymer rim disposed on a peripheral portion of the device side comprising less than approximately 5% of the DSSA;
- and
- a main body having a thickness less than 300 microns.
A semiconductor workpiece having a device side and a back side, the workpiece comprising:
- a main body having a thickness greater than approximately 600 microns;
- and
- a polymer rim disposed on a peripheral portion of the device side of the workpiece.
A process for thinning a back side of a semiconductor workpiece having a main body and a polymer rim disposed on a peripheral portion of the workpiece, the process comprising the steps of:
- placing the semiconductor workpiece onto a chuck body so that the back side of the workpiece is exposed;
- attaching a retainer to the chuck body and the rim so that the workpiece is secured to the chuck;
- and
- thinning the back side of the workpiece so that the main body thickness is less than 300 microns.
A process for thinning a semiconductor workpiece having a device side and a back side, the process comprising the steps of:
- attaching a rim to a peripheral portion of the device side of the workpiece;
- placing the semiconductor workpiece onto a chuck body so that the back side of the workpiece is exposed;
- attaching a retainer to the chuck body and the rim so that the workpiece is secured to the chuck;
- and
- thinning the workpiece to a desired thickness.
A process for thinning a semiconductor workpiece having a device side and a back side, the process comprising the steps of:
- attaching a rim to a peripheral portion of the device side of the workpiece;
- placing the semiconductor workpiece onto a chuck body so that the back side of the workpiece is exposed;
- creating a vacuum seal between the workpiece and the chuck body so that the workpiece is secured to the chuck body;
- and
- thinning the workpiece to a desired thickness.
Dependencies are inferred from the claim text.