Manufacturing method of an electronic part built-in substrate
AssigneeShinko Electric Industries Co., Ltd.
InventorMasahiro Sunohara
Life of this patent
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Abstract
A manufacturing method of an electronic part built-in substrate is disclosed, wherein an electronic part is contained in a build-up layer, the manufacturing method including a step for arranging an electronic part on a conductive supporting object such that the electronic part is electrically connected to the conductive supporting object, a step for forming build-up layers on the supporting object such that the electronic part is contained in the build-up layers, and a step for forming a wiring layer electrically connected to the electronic part by shaping the supporting object.
Claims4
A manufacturing method of an electronic part built-in substrate that contains an electronic part in a build-up layer, comprising:
- a process of arranging the electronic part on a supporting object that consists of a conductive material so that the electronic part is electrically connected to the supporting object;
- a process of forming a build-up layer on the supporting object on which the electronic part is arranged so that the electronic part is contained;
- and
- a wiring formation process of forming a wiring layer connected to the electronic part by shaping the conductive supporting object.
A manufacturing method of an electronic part built-in substrate that contains an electronic part in a build-up layer, comprising:
- a first build-up layer forming process of forming one or more build-up layers on a supporting object that consists of a conductive material, the build-up layers being laminated to a thickness equivalent to a thickness of the electronic part, constituting a first build-up layer;
- a cavity formation process of forming a cavity for accommodating the electronic part in the build-up layers that are laminated;
- an accommodation process of accommodating the electronic part to the cavity,
- a second build-up layer forming process of forming a build-up layer further on the first build-up layer to which the cavity is formed, and on the electronic part;
- and
- a wiring formation process of forming a wiring layer connected to the electronic part by shaping the conductive supporting object.
Dependencies are inferred from the claim text.