US 2006/0040426 A1 · Circuitized substrate, method of making same and information handling system using same

Abstract

A method of making a circuitized substrate in which the substrate's commoning bar, used during the plating of the circuitry on the substrate, is terminated from the various conductors using a laser. In a preferred embodiment, the laser acts through a dielectric layer (soldermask) which is applied over the circuitry, including the commoning bar and connected parts. The laser may also be used to expose selected ones of the circuit's other parts, including various pads used to accommodate a wirebond (from a chip) and also solder balls for eventual placement of the substrate on a larger circuit board.

Claims20

Dependent claims

A method of making a circuitized substrate, said method comprising:

providing a first dielectric layer having a first surface and a second opposing surface;
forming a first pattern of conductors and a second pattern of conductors spaced from said first pattern and electrically coupled thereto on said first surface of said first dielectric layer;
forming a common conductive line on said second opposing surface of said first dielectric layer and electrically connected to each of said conductors of said second pattern of conductors;
and
thereafter terminating said electrical connections between each of said conductors of said second pattern of conductors and said common conductive line using a laser.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

11/258,092Filed 26 Oct 2005

Priority

7 Oct 2003

Published

23 Feb 2006

Term ends

Not estimatedThe source records don’t support an estimate.

Classification14 codes

H10W 70/05
Manufacture or treatment: of insulating or insulated package substrates, or of interposers, or of redistribution layers
H05K 3/242
Characterised by the electroplating method; means therefor, e.g. baths or apparatus: characterised by using temporary conductors on the printed…
H10W 70/65
Characterised by their interconnections: shapes or dispositions of interconnections
H05K 3/0035
Of organic insulating material: of blind holes, i.e. having a metal layer at the bottom

Circuitized substrate, method of making same and information handling system using same

Life of this patent

Circuitized substrate, method of making same and information handling system using same

Life of this patent

Abstract

Claims20