Semiconductor device substrate, semiconductor device, and manufacturing method thereof
AssigneeShinko Electric Industries Co., Ltd.
InventorsKiyoshi Ooi, Yasuyoshi Horikawa, Akio Rokugawa
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Abstract
A method of manufacturing a semiconductor device substrate includes the steps of: arranging on a base a temporary fixing member for temporarily fixing an electronic component; temporarily fixing the electronic component on the base by the temporary fixing member; forming a substrate body on the base and the electronic component; removing a portion of the base which portion corresponds to the electronic component, thereby exposing the temporary fixing member; and removing the temporary fixing member, thereby enabling the electronic component to make an external connection.
Claims9
A method of manufacturing a semiconductor device substrate, said method comprising the steps of:
- arranging on a base a temporary fixing member for temporarily fixing an electronic component;
- temporarily fixing the electronic component on the base by using the temporary fixing member;
- forming a substrate body on the base and the electronic component;
- removing at least a portion of the base which portion corresponds to the electronic component, thereby exposing the temporary fixing member;
- and
- removing the temporary fixing member, thereby enabling the electronic component to make an external connection.
Dependencies are inferred from the claim text.