Post-deposition encapsulation of nanostructures: compositions, devices and systems incorporating same
AssigneeNanosys, Inc.
InventorsJeffery Whiteford, Rhett Brewer, Mihai Buretea, Jian Chen, Karen Cruden, Xiangfeng Duan, William Freeman, David Heald, Francisco Leon, Chao Liu, Andreas Meisel, Kyu Min, J. Parce, Erik Scher
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