Phase-changeable memory devices including an adiabatic layer and methods of forming the same
AssigneeSamsung Electronics Co., Ltd.
InventorsYong-Ho Ha, Bong-Jin Kuh, Ji-Hye Yi, Jun-Soo Bae
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Abstract
Phase-changeable memory devices include a lower electrode electrically connected to an impurity region of a transistor in a substrate and a programming layer pattern including a first phase-changeable material on the lower electrode. An adiabatic layer pattern including a material having a lower thermal conductivity than the first phase-changeable material is on the programming layer pattern and an upper electrode is on the adiabatic layer pattern.
Claims30
A phase-changeable memory device comprising:
- a lower electrode electrically connected to an impurity region of a transistor in a substrate;
- a programming layer pattern including a first phase-changeable material on the lower electrode;
- an adiabatic layer pattern including a material having a lower thermal conductivity than the first phase-changeable material on the programming layer pattern;
- and
- an upper electrode on the adiabatic layer pattern.
A method of manufacturing a phase-changeable memory device, the method comprising:
- forming a lower electrode electrically connected to an impurity region of a transistor on the substrate;
- forming a programming layer including a first phase-changeable material on the lower electrode;
- forming an adiabatic layer including a material having a lower thermal conductivity than the first phase-changeable material on the programming layer pattern;
- forming a conductive layer on the adiabatic layer;
- and
- partially etching the conductive layer, the adiabatic layer and the programming layer to form an upper electrode, an adiabatic layer pattern and a programming layer pattern.
A method of manufacturing a phase-changeable memory device, the method comprising:
- forming a transistor including a gate structure and first and second impurity regions on a substrate;
- forming a wiring line electrically connected to the first impurity region on the substrate;
- forming a lower electrode electrically connected to the second impurity region on the substrate;
- forming a preliminary adiabatic layer structure that includes a first adiabatic layer including a first phase-changeable material and a second adiabatic layer including a different second phase-changeable material, the first and second adiabatic layers being alternately and repeatedly stacked;
- forming a conductive layer on the preliminary adiabatic layer structure;
- partially etching the conductive layer and the first and second adiabatic layers to form an adiabatic layer structure on the lower electrode;
- heating a lower portion of the adiabatic layer structure that makes contact with the lower electrode to form a programming layer pattern including a different third phase-changeable material formed from heating of a material in the lower portion of the adiabatic layer structure;
- and
- forming an upper electrode on the adiabatic layer structure.
Dependencies are inferred from the claim text.