Miniaturized fan module
AssigneeInventec Corporation
InventorShu-Ju Lin
Life of this patent
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Abstract
A miniaturized fan module can be accommodated in an electronic system (such as a server) to provide heat dissipation. The miniaturized fan module has a smaller structural size than that of a conventional fan module, such that a larger bump-preventing buffer space between the miniaturized fan module and a framework of the server is provided for preventing the fan module from bumping against the server framework due to vibration generated in practical operation, without degrading a heat dissipating effect and structural strength of the fan module.
Claims6
A miniaturized fan module for being assembled to a framework of an electronic system, the miniaturized fan module comprising:
- a pair of outer frames, each of the outer frames comprising a first surface and a second surface, wherein an inner wall is formed between the first surface and the second surface of each of the outer frames, and the two outer frames are spaced apart by a predetermined distance face to face to cooperatively form a fan accommodating space between the inner walls thereof;
- a pair of strengthening members respectively secured to the first surfaces and the second surfaces of the two outer frames to bridge the outer frames, such that the two outer frames are coupled together by the strengthening members;
- and
- a fan unit disposed in the fan accommodating space formed between the two outer frames coupled together by the strengthening members, so as to provide winds.
Dependencies are inferred from the claim text.